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Automatic Die Sorer:KS-850
Automatic Die Sorer:KS-850
  • * Automatic bin sorting system for single bin & multi bin.
  • * Quickly change tape frame design.
  • * Output Feeder stage for 8² and 12² is changeable.
  • * Wafer mapping function is available.
  • * Wafer /Carrier available, kit exchange easily.
  • * High speed and reliable linear Pick & Place module.
張欽華

T:886-2-22682216 #2001

E:algo@gmmcorp.com.tw



規格

Accuracy

X,Y=±50μm,θ=±0.2°

chip size

0.6x0.6mm~25x25mm

Wafer Size >12" Standard(8" Option)

Input Wafer Load/Unload

Automatic

Output Wafer Load/Unload

Automatic

Automatic bin sorting system

Single bin/Multi Bin

Mapping Easy mapping/File mapping/Barcode reader(Option)
Cycle Time ≤0.5 sec(Excluding pick and place delay time)
Tack Time(for wafer change at unloader) ≤10 sec

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