- * High reliability and high accuracy bonding head with VCM force control.
- * High efficiency post Inspection of bonding accuracy.
- * Glue stamping unit is optional.
- * Production SPC & self-diagnosis functions are optional.
- * IR post curing unit for thermal glue function is optional.
- * Product Input & output function can be customized.
High Precision Die Bonder：KB-5600 Series
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張欽華 |
T:886-2-22682216 #2001 |
| 規格 | |
|---|---|
|
Accuracy |
X,Y:<10μm,θ=±0.5° |
|
Die size |
0.8x0.8mm~15x15mm |
| Die Thickness | 0.1-4mm |
|
Die Input |
Customization: 8"~12" Wafer/2"~4" IC Chip Tray/JEDEC Tray |
|
Die bonding material |
Customization:Silicon Wafer/Glass Based/PCB Substrate |
|
Substrate Wafer Load/Unload |
Manual/Automatic |
| Cycle Time & UPH | 1、Tracing included in bond time.2、Include pick & place machine cycle.3、IR post cure 1.5sec(won't make UPH worse) |
| Glue or Epoxy | Stamping available |
| Bonding Force Control | 1N~6N; Programmable by VCM |
|
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